Volume 7, Issue 2, June 2018, Page: 26-33
Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity
Diancheng Qin, Guangdong LED Packaging-Used Heat Dissipation Substrate Engineering Technology Research Center, Rayben Technologies (Zhuhai) Limited, ZhuHai, China
Yonglong Xiao, Guangdong LED Packaging-Used Heat Dissipation Substrate Engineering Technology Research Center, Rayben Technologies (Zhuhai) Limited, ZhuHai, China
Kewei Liang, Guangdong LED Packaging-Used Heat Dissipation Substrate Engineering Technology Research Center, Rayben Technologies (Zhuhai) Limited, ZhuHai, China
Received: May 14, 2018;       Accepted: Jun. 6, 2018;       Published: Jun. 29, 2018
DOI: 10.11648/j.am.20180702.13      View  1449      Downloads  177
Abstract
High thermally conductive cuboid aluminum nitride block was used as reinforcement material to fill the FR4 matrix for the fabrication of a novel FR4/AlN PCB (Printed Circuit Board) with high thermal conductivity. This novel PCB was subjected to a thermal shock test of 1500 cycles from -40°C keeping 30 minutes to 125°C keeping 30 minutes during 1000 hours with transfer time less than 10 seconds, presented an excellent reliability since there was no crack and delamination emerging. By performing a comparative study between FR4/AlN PCB and anodized MCPCB, it was found that the thermal resistance of both PCB were 0.63°C /W and 2.74°C /W respectively. When CREE XTE LEDs were mounted on FR4/AlN PCB and anodized MCPCB using SMT technology to dissipate heat respectively, the LEDs’ junction temperature were 37°C and 42.1°C and the overall corresponding thermal resistance were 3.93°C /W and 6.43°C /W accordingly. Therefore, a conclusion can be drawn that this novel PCB exhibits a more excellent heat dissipation performance than 30W/m·K anodized MCPCB does and it is a promising alternative of MCPCB for heat dissipation of high power electronic devices like LEDs.
Keywords
FR4/AlN PCB, Anodized PCB, Heat Dissipation, LED, Junction Temperature, Thermal Resistance
To cite this article
Diancheng Qin, Yonglong Xiao, Kewei Liang, Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity, Advances in Materials. Vol. 7, No. 2, 2018, pp. 26-33. doi: 10.11648/j.am.20180702.13
Copyright
Copyright © 2018 Authors retain the copyright of this article.
This article is an open access article distributed under the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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